TSMC, Infineon Extends Collaboration to 65nm eFlash MCUs
November 06, 2009
Taiwanese semiconductor foundry TSMC and
Germany-based semiconductor and system solution provider Infineon Technologies announced
on November 5 that they will extend their collaboration to 65nm eFlash
(embedded Flash) process technology, Taiwan's Economic Daily News reported. It
is expected that the two companies will join hands to develop 65nm eFlash MCUs
(Microcontroller Units) for automotive electronics as well as chip cards and
security applications. Process and product qualification for security MCUs is
slated for the second half of 2012, and production of automotive MCUs is
projected to commence in the first half of 2013. It is expected that TSMC will go
on to manufacture the full array of Infineon's security MCUs featuring
contact-based, contact-less or dual interface.